DATA SHEET

Generated with MOOJ Proforms Version 1.3

DATA SHEET

 

PCB code
PCB type
1 copper layer
2 copper layers
4 copper layers
Other (specify)
PCB material
FR4
TEFLON (Cuclad, Diclad...)
Other (specify)
PCB thickness:
1,60 mm
2,00 mm
2,40 mm
Other (specify thickness):
Copper thickness:
35µ
70µ
105µ
Other (copper thickness):
Single PCB dimensions
Panelize PCB dimensions (specify the panelization in the notes below):

PCB complexity:

Minimum hole diamete
< = 0,30 mm
> = 0,30 mm
Minimum spacing ( pads and tracks):
< = 0,20 mm
> = 0,20 mm
Minimum track width:
< = 0,20 mm
> = 0,20 mm
SMD:
1 Layer SMD
2 Layers SMD
Passo SMD < = 0,50mm
Passo SMD > 0,50mm

FINISHES

Gold connector
No
Yes
If yes specify the number of pins:
If yes Gold thickness (0,8µ Au standard)
Metallic finishes (Surfusione, H.A.L., doratura chimica, …):
Hot Air Levelling Lead free
Hot Air Levelling Tin/Lead
other (specify: e.g.: Flash gold)
Solder resist mask
LC
LS
Silkscreen:
LC
LS
Peleable mask:
LC
LS

TEST REQUIRED

Test Required
Thru-hole technology
1 lato SMD
2 layers SMD
Optical test

 

OTHER INFORMATIONS:

N° of Pieces required
Delivery time: (see the delivery time table)
NOTES

 

Specificare se possibile nelle note le caratteristiche dell'SMD - passo minimo tra due pads e dimensioni minime PADS, in pollici.

 

 

SENDER DATA

Company
Name
Address
Phone
Fax
Email
I would like to receive the offer via:
Fax
Email
Letter

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