After undergoing the various treatments, the panels are brought to the routing department where, by means of CNC machines, they are separated into single circuit boards or their multiples, and their perimeter is thus defined and cut.

The particular processing operations carried out in this department are scoring and chamfering.

When panels containing two or more circuit boards are required, the various boards are separated by means of scoring. This operation involves making surface cuts in order to mark off the various circuit boards.
The chamfering process is the bevelling of the circuit board outer edge, on the connector side, to facilitate its fitting onto the connectors.