Final testing includes statistical tests - depending on the number of pieces in the batch of circuit boards - on the following dimensional characteristics: cutout and/or scoring dimensions, chamfering bevels, slot and plate dimensions, hole diameter, track width and insulation, laminate thickness.

The test instruments range from a hundredfold magnifying microscope to calibrated pads.

Furthermore, the following is checked using various methods: solder resist bond and component symbology, solder resist polymerisation and component symbology, gold and nickel bond, and circuit planarity.
 
Finally, we check the following elements: that any marking requested by the customer has been made, the centring and definition of the solder resist and component symbology, any uncovered tracks, the presence of dirt under and on the solder resist, the proper metallization on blind holes and the general appearance of the circuit board.

After all the tests have been carried out, a copy of the Certificate of Conformity (Form 1110-S) is issued to the customer on request, ICS keeping the original.